The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.
1. PART I: INTRODUCTION AND OVERVIEW - p. 8 2. Chapter 1: Overview and Evolution of Silicon Wafer Cleaning Technology - p. 9 3. Chapter 2: Overview of Wafer Contamination and Defectivity - p. 40 4. PART II: WET CHEMICAL PROCESS - p. 64 5. Chapter 3: Particle Deposition and Adhesion - p. 65 6. Chapter 4: Aqueous Cleaning and Surface Conditioning Processes - p. 74 7. PART III: DRY CLEANING PROCESSES - p. 98 8. Chapter 5: Gas-phase Wafer Cleaning Technology - p. 99 9. Chapter 6: Plasma Stripping, Cleaning, and Surface Conditioning - p. 126 10. Chapter 7: Cryogenic Aerosols and Supercritical Fluid Cleaning - p. 149 11. PART IV: ANALYTICAL AND CONTROL ASPECTS - p. 159 12. Chapter 8: Detection and Measurement of Particulate Contaminants - p. 160 13. Chapter 9: Surface Chemical Composition and Morphology - p. 174 14. Chapter 10: Ultratrace Impurity Analysis of Wafer Surfaces - p. 210 15. PART V: DIRECTIONS FOR THE NEAR FUTURE - p. 223 16. Chapter 11: New Cleaning and Surface Conditioning Techniques and Technologies - p. 224 17. Book Editors and Chapters Authors - p. 234 18. Index - p. 238 19. Materials Science and Process Technology Series - p. 247
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.
1. PART I: INTRODUCTION AND OVERVIEW - p. 8 2. Chapter 1: Overview and Evolution of Silicon Wafer Cleaning Technology - p. 9 3. Chapter 2: Overview of Wafer Contamination and Defectivity - p. 40 4. PART II: WET CHEMICAL PROCESS - p. 64 5. Chapter 3: Particle Deposition and Adhesion - p. 65 6. Chapter 4: Aqueous Cleaning and Surface Conditioning Processes - p. 74 7. PART III: DRY CLEANING PROCESSES - p. 98 8. Chapter 5: Gas-phase Wafer Cleaning Technology - p. 99 9. Chapter 6: Plasma Stripping, Cleaning, and Surface Conditioning - p. 126 10. Chapter 7: Cryogenic Aerosols and Supercritical Fluid Cleaning - p. 149 11. PART IV: ANALYTICAL AND CONTROL ASPECTS - p. 159 12. Chapter 8: Detection and Measurement of Particulate Contaminants - p. 160 13. Chapter 9: Surface Chemical Composition and Morphology - p. 174 14. Chapter 10: Ultratrace Impurity Analysis of Wafer Surfaces - p. 210 15. PART V: DIRECTIONS FOR THE NEAR FUTURE - p. 223 16. Chapter 11: New Cleaning and Surface Conditioning Techniques and Technologies - p. 224 17. Book Editors and Chapters Authors - p. 234 18. Index - p. 238 19. Materials Science and Process Technology Series - p. 247
